Zhongming Porcelain (Suzhou) Nano Powder Technology Co., Ltd. (hereinafter referred to as Zhongming Porcelain) was established in November 2017 with a registered capital of 10 million RMB. It is a high-tech new material startup integrating scientific research, production, and sales. Currently, the company has established industry-university-research cooperation institutions with five domestic and international research institutes, and has set up a new material cooperation center with DuPont in the United States. Additionally, it has established new material R&D cooperation centers at Erlangen University and Nuremberg University in Germany, Magdeburg University, Beijing University of Civil Engineering and Architecture, Soochow University, and the Institute of Nanotechnology, Chinese Academy of Sciences. These collaborations provide strong support for core technology development and lay a solid foundation for the company's continuous innovation and development.Since its establishment, the company has thrived on innovation, emphasizing talent cultivation and dedicating itself to the research and production of high-tech new materials. It has obtained 12 invention patents, 22 utility model patents, and 16 software copyrights in the development of nano powder multi layer chips. The company has successfully transformed these high-tech achievements into marketable products, including "general semiconductor, photoelectric corrosion-resistant materials, LTCC & HTCC multi layer chip integrated packaging new materials, and ceramic tube shells for general semiconductors." These products are safe, reliable, of excellent quality, and highly recognized by users,offering sustainable development potential and broad market prospects.China Porcelain nano powder multi layer chip integrated production line project mainly includes the following three core technology modules and 46 core technology products:1. General semiconductor, photoelectric corrosion-resistant nano powder materials:This module features advanced core technologies and products used in high-end equipment with broad development prospects. Once in production, it will further accelerate the industrialization of photoelectric corrosion-resistant multi layer chips, speeding up the production of series products in two categories-high-purity yttrium-based raw materials and high-density coating corrosion-resistant materials with nine specifications. These products are primarily used for protecting core equipment in chip production, such as PVD, CVD, IMP, DIFF, CMP, PHOTO equipment, and can meet the operational needs of advanced domestic equipment.2. Multi layer chip integrated packaging new materials and ceramic tube shells:The core LTCC electronic component products in this module include filters, duplexers, antennas, baluns, couplers, power splitters, common mode chokes, ceramic tube shells, precision ceramic rings, and more, widely used in mobile communication terminals, WiFi, automotive electronics, T/R modules, and other fields.In addition, HTCC high-end packaging materials are mainly used for RF filters (SAW/BAW), RF ICs, image sensors, uncooled infrared focal plane sensors, LDMOS, CMOS, MEMS sensors, and more.3. General semiconductor, photoelectric advanced ceramic material components:The core products of this module mainly include wafer handling systems, such as vacuum robotic arms, atmospheric ceramic arms, and composite ceramic arms. Key ceramic core components involve a complete set of processes from raw powder to ceramic parts to high-density sintering and fine processing. The main products include (Subsystems Critical Components) electrostatic chuck devices, anti-static porous ceramic chucks, metal-ceramic assemblies, and more.
